TEE-IO Device Validation Utility

Intel TDX Connect adds “device” to TEE scope. “Device” need to follow standard protocols (SPDM, IDE, TDISP) to communicate with Intel Root Port and Intel TDX TSM. We need validate the interoperability between the device and Intel component.

TEE-IO Device Validation Utility is proposed to validate the interoperability of standard protocols (SPDM/IDE/TDISP) between the device and Intel component.

Documentation

TEE-IO Device Validation Utility Build

TEE-IO Device Validation Utility Usage

ide_test.ini spec

FAQ

IDE_KM Test

Test Case

1. Test for QUERY

2. Test for KEY_PROG

3. Test for K_SET_GO

4. Test for K_SET_STOP

5. Test for SPDM Session

Test Configuration

1. Test for Selective IDE

2. Test for Link IDE

3. Test for both Selective IDE and Link IDE enabling

Test Topology

1. Test for Selective IDE

2. Test for Link IDE

3. Test for both Selective IDE and Link IDE enabling

Standard

DMTF

DMTF DSP0274 Security Protocol and Data Model (SPDM) Specification (version 1.2.2)

DMTF DSP0277 Secured Messages using SPDM Specification (version 1.1.1)

PCI-SIG

PCIe Base Specification Version 6.0.1, 6.1, 6.2.

PCIe DOE 1.0 ECN for PCIe 4.0, 5.0 (integrated in 6.0), DOE 1.1 ECN for PCIe 5.0, 6.0 (integrated in 6.1).

PCIe CMA ECN for PCIe 4.0, 5.0 (integrated in 6.0), CMA Revised ECN for PCIe 6.1 (integrated in 6.2).

PCIe IDE ECN for PCIe 5.0 (integrated in 6.0).

PCIe TDISP ECN for PCIe 5.0, 6.0 (integrated in 6.1).

CXL

Compute Express Link Specification Revision 3.0, 3.1

Intel

Intel Root Complex IDE Key Configuration Unit - Software Programming Guide