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SD2IEC.kicad_pcb
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SD2IEC.kicad_pcb
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(kicad_pcb (version 20211014) (generator pcbnew)
(general
(thickness 1.6)
)
(paper "USLetter")
(title_block
(title "SD2IEC")
(date "2022-09-18")
(rev "A")
)
(layers
(0 "F.Cu" signal)
(31 "B.Cu" signal)
(32 "B.Adhes" user "B.Adhesive")
(33 "F.Adhes" user "F.Adhesive")
(34 "B.Paste" user)
(35 "F.Paste" user)
(36 "B.SilkS" user "B.Silkscreen")
(37 "F.SilkS" user "F.Silkscreen")
(38 "B.Mask" user)
(39 "F.Mask" user)
(40 "Dwgs.User" user "User.Drawings")
(41 "Cmts.User" user "User.Comments")
(44 "Edge.Cuts" user)
(45 "Margin" user)
(46 "B.CrtYd" user "B.Courtyard")
(47 "F.CrtYd" user "F.Courtyard")
(48 "B.Fab" user)
(49 "F.Fab" user)
)
(setup
(stackup
(layer "F.SilkS" (type "Top Silk Screen") (color "White"))
(layer "F.Paste" (type "Top Solder Paste"))
(layer "F.Mask" (type "Top Solder Mask") (color "Green") (thickness 0.01))
(layer "F.Cu" (type "copper") (thickness 0.035))
(layer "dielectric 1" (type "core") (thickness 1.51) (material "FR4") (epsilon_r 4.5) (loss_tangent 0.02))
(layer "B.Cu" (type "copper") (thickness 0.035))
(layer "B.Mask" (type "Bottom Solder Mask") (color "Green") (thickness 0.01))
(layer "B.Paste" (type "Bottom Solder Paste"))
(layer "B.SilkS" (type "Bottom Silk Screen") (color "White"))
(copper_finish "None")
(dielectric_constraints no)
)
(pad_to_mask_clearance 0)
(aux_axis_origin 83.82 78.66)
(grid_origin 83.82 78.66)
(pcbplotparams
(layerselection 0x00010f0_ffffffff)
(disableapertmacros false)
(usegerberextensions true)
(usegerberattributes true)
(usegerberadvancedattributes false)
(creategerberjobfile false)
(svguseinch false)
(svgprecision 6)
(excludeedgelayer true)
(plotframeref false)
(viasonmask false)
(mode 1)
(useauxorigin false)
(hpglpennumber 1)
(hpglpenspeed 20)
(hpglpendiameter 15.000000)
(dxfpolygonmode true)
(dxfimperialunits true)
(dxfusepcbnewfont true)
(psnegative false)
(psa4output false)
(plotreference true)
(plotvalue false)
(plotinvisibletext false)
(sketchpadsonfab false)
(subtractmaskfromsilk true)
(outputformat 1)
(mirror false)
(drillshape 0)
(scaleselection 1)
(outputdirectory "plot")
)
)
(net 0 "")
(net 1 "GND")
(net 2 "Net-(C1-Pad1)")
(net 3 "Net-(C2-Pad1)")
(net 4 "+3.3V")
(net 5 "Net-(C8-Pad1)")
(net 6 "unconnected-(U1-Pad43)")
(net 7 "unconnected-(U1-Pad42)")
(net 8 "unconnected-(U1-Pad41)")
(net 9 "unconnected-(U1-Pad40)")
(net 10 "unconnected-(U1-Pad34)")
(net 11 "unconnected-(U1-Pad30)")
(net 12 "unconnected-(U1-Pad26)")
(net 13 "unconnected-(U1-Pad13)")
(net 14 "/AREF")
(net 15 "+5V")
(net 16 "unconnected-(U1-Pad12)")
(net 17 "unconnected-(U2-Pad4)")
(net 18 "Net-(J3-Pad8)")
(net 19 "Net-(J3-Pad9)")
(net 20 "/~{SD_CS}")
(net 21 "Net-(J1-Pad5)")
(net 22 "/MOSI")
(net 23 "/SCK")
(net 24 "/MISO")
(net 25 "Net-(Q1-Pad2)")
(net 26 "/IEC_CLK/WRITE")
(net 27 "Net-(Q2-Pad2)")
(net 28 "/IEC_DATA/WRITE")
(net 29 "Net-(Q3-Pad2)")
(net 30 "/IEC_ATN/WRITE")
(net 31 "/IEC_CLK/READ")
(net 32 "/IEC_DATA/READ")
(net 33 "/IEC_ATN/READ")
(net 34 "/IEC_DATA")
(net 35 "/~{IEC_RESET}")
(net 36 "/IEC_CLK")
(net 37 "/~{IEC_SQR}")
(net 38 "/IEC_ATN")
(net 39 "unconnected-(U1-Pad9)")
(net 40 "unconnected-(U1-Pad10)")
(net 41 "/~{WRITE_PROTECT}")
(net 42 "/~{CARD_DETECT}")
(net 43 "unconnected-(U1-Pad23)")
(net 44 "unconnected-(U1-Pad24)")
(net 45 "unconnected-(U1-Pad25)")
(net 46 "/IEC8_9")
(net 47 "/IEC10_11")
(net 48 "/PREV")
(net 49 "/NEXT")
(net 50 "/BUSY")
(net 51 "/DIRTY")
(net 52 "/BUSY_LED")
(net 53 "/DIRTY_LED")
(net 54 "unconnected-(J2-Pad3)")
(net 55 "unconnected-(J2-Pad4)")
(net 56 "unconnected-(J2-Pad5)")
(net 57 "unconnected-(J2-Pad6)")
(footprint "Connector:Tag-Connect_TC2030-IDC-NL_2x03_P1.27mm_Vertical" (layer "F.Cu")
(tedit 62016E06) (tstamp 00000000-0000-0000-0000-000060ddca8c)
(at 104.775 83.74 90)
(descr "Tag-Connect programming header; http://www.tag-connect.com/Materials/TC2030-IDC-NL.pdf")
(tags "tag connect programming header pogo pins")
(property "Sheetfile" "SD2IEC.kicad_sch")
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(pad "" np_thru_hole circle (at 2.54 -1.016 90) (size 0.9906 0.9906) (drill 0.9906) (layers *.Cu *.Mask) (tstamp a25e6137-1b07-40a0-9015-45eceab5a658))
(pad "" np_thru_hole circle (at -2.54 0 90) (size 0.9906 0.9906) (drill 0.9906) (layers *.Cu *.Mask) (tstamp ce35931d-681f-43a4-b643-c13fc3708438))
(pad "" np_thru_hole circle (at 2.54 1.016 90) (size 0.9906 0.9906) (drill 0.9906) (layers *.Cu *.Mask) (tstamp f16a9576-344a-4167-a2d8-5a2f6c496fd1))
(pad "1" connect circle (at -1.27 0.635 90) (size 0.7874 0.7874) (layers "F.Cu" "F.Mask")
(net 24 "/MISO") (pinfunction "MISO") (pintype "passive") (tstamp 9c1fa041-f433-44f2-a927-e35cec498176))
(pad "2" connect circle (at -1.27 -0.635 90) (size 0.7874 0.7874) (layers "F.Cu" "F.Mask")
(net 15 "+5V") (pinfunction "VCC") (pintype "passive") (tstamp 5da6ea1a-7991-402c-b386-85c3d70f7149))
(pad "3" connect circle (at 0 0.635 90) (size 0.7874 0.7874) (layers "F.Cu" "F.Mask")
(net 23 "/SCK") (pinfunction "SCK") (pintype "passive") (tstamp 77f85d85-4816-45dc-bb85-269c829080f5))
(pad "4" connect circle (at 0 -0.635 90) (size 0.7874 0.7874) (layers "F.Cu" "F.Mask")
(net 22 "/MOSI") (pinfunction "MOSI") (pintype "passive") (tstamp 5bf90e69-8181-4d7c-8726-0c0a71513398))
(pad "5" connect circle (at 1.27 0.635 90) (size 0.7874 0.7874) (layers "F.Cu" "F.Mask")
(net 21 "Net-(J1-Pad5)") (pinfunction "~{RST}") (pintype "passive") (tstamp 7b8d921d-6efa-4c73-a313-1fbf861628c7))
(pad "6" connect circle (at 1.27 -0.635 90) (size 0.7874 0.7874) (layers "F.Cu" "F.Mask")
(net 1 "GND") (pinfunction "GND") (pintype "passive") (tstamp f7bc235e-2c21-4dcb-a347-bc5722ba0dff))
(zone (net 0) (net_name "") (layer "F.Cu") (tstamp fa4eb269-aea0-4f42-9a2a-0419baa71e7f) (hatch full 0.508)
(connect_pads (clearance 0))
(min_thickness 0.254)
(keepout (tracks allowed) (vias not_allowed) (pads allowed) (copperpour not_allowed) (footprints not_allowed))
(fill (thermal_gap 0.508) (thermal_bridge_width 0.508))
(polygon
(pts
(xy 104.14 82.47)
(xy 104.14 85.01)
(xy 105.41 85.01)
(xy 105.41 82.47)
)
)
)
)
(footprint "Capacitor_SMD:C_0805_2012Metric_Pad1.18x1.45mm_HandSolder" (layer "F.Cu")
(tedit 5F68FEEF) (tstamp 00000000-0000-0000-0000-000060ddcaa2)
(at 102.512 103.092 180)
(descr "Capacitor SMD 0805 (2012 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: IPC-SM-782 page 76, https://www.pcb-3d.com/wordpress/wp-content/uploads/ipc-sm-782a_amendment_1_and_2.pdf, https://docs.google.com/spreadsheets/d/1BsfQQcO9C6DZCsRaXUlFlo91Tg2WpOkGARC1WS5S8t0/edit?usp=sharing), generated with kicad-footprint-generator")
(tags "capacitor handsolder")
(property "Sheetfile" "SD2IEC.kicad_sch")
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