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Soldering the coulomb counter has been a constant issue due to shorting under the DFN pads. Extending the pads beyond the outline of the package will make it easier to see when the chip is aligned and provide overflow area for the solder paste.
The text was updated successfully, but these errors were encountered:
Soldering the coulomb counter has been a constant issue due to shorting under the DFN pads. Extending the pads beyond the outline of the package will make it easier to see when the chip is aligned and provide overflow area for the solder paste.
The text was updated successfully, but these errors were encountered: